US 12,411,364 B2
Optical module and manufacturing method of optical module for optical communication
Hiroshi Uemura, Osaka (JP); Keiji Tanaka, Osaka (JP); and Taichi Misawa, Osaka (JP)
Assigned to Sumitomo Electric Industries, Ltd., Osaka (JP)
Filed by Sumitomo Electric Industries, Ltd., Osaka (JP)
Filed on Dec. 20, 2022, as Appl. No. 18/085,200.
Claims priority of application No. 2021-208393 (JP), filed on Dec. 22, 2021.
Prior Publication US 2023/0194903 A1, Jun. 22, 2023
Int. Cl. G02F 1/01 (2006.01); C09J 1/00 (2006.01); G02F 1/21 (2006.01)
CPC G02F 1/0121 (2013.01) [C09J 1/00 (2013.01); G02F 1/0102 (2013.01); G02F 1/212 (2021.01); G02F 2202/28 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An optical module comprising:
a housing having a first face and a second face parallel to the first face;
a first block fixed to the first face of the housing by a first adhesive;
an integrated circuit (IC) fixed to the first block by a second adhesive having a thickness larger than a thickness of the first adhesive;
a thermoelectric cooler (TEC) fixed to the second face of the housing;
an optical circuit element fixed to the TEC; and
an interconnection board mounted on the IC and the optical circuit element, the interconnection board being configured to electrically couple the IC to the optical circuit element;
wherein the first block is sandwiched between the housing and the IC, and
wherein the TEC is sandwiched between the housing and the optical circuit element.