US 12,411,280 B2
Discrete optical unit on a substrate of an integrated photonics chip
Michael J. Bishop, San Carlos, CA (US); Vijay M. Iyer, Mammoth Lakes, CA (US); Lexie Nicole Schachne, Palo Alto, CA (US); and Jason Pelc, Sunnyvale, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Apr. 14, 2023, as Appl. No. 18/134,865.
Application 18/134,865 is a continuation of application No. 17/254,810, granted, now 11,644,618, previously published as PCT/US2019/038599, filed on Jun. 21, 2019.
Claims priority of provisional application 62/689,018, filed on Jun. 22, 2018.
Prior Publication US 2023/0251420 A1, Aug. 10, 2023
Int. Cl. G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/12004 (2013.01) [G02B 6/122 (2013.01); G02B 6/4244 (2013.01); G02B 2006/12104 (2013.01); G02B 2006/12138 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An integrated photonics device including:
a photonics substrate comprising:
a supporting layer, and
a plurality of additional layers disposed on the supporting layer and configured to define a waveguide, wherein:
the photonics substrate defines a cavity extending through the plurality of additional layers and defining a facet wall in the plurality of additional layers; and
the waveguide intersects the facet wall; and
a discrete optical unit positioned at least partially in the cavity and connected to the supporting layer within the cavity, the discrete optical unit comprising:
a receiving facet formed from a first surface of the discrete optical unit;
a mirror formed at a second surface of the discrete optical unit;
an attachment portion directly connected to a bottom surface of the cavity; and
an overhang positioned above the plurality of additional layers, wherein:
the receiving facet is positioned to receive light that exits the waveguide at the facet wall, and
the mirror is positioned to redirect the light received by the receiving facet.