US 12,411,279 B2
Integrated circuit package and method of forming same
Chen-Hua Yu, Hsinchu (TW); Jiun Yi Wu, Zhongli (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Feb. 17, 2023, as Appl. No. 18/111,290.
Claims priority of provisional application 63/379,015, filed on Oct. 11, 2022.
Claims priority of provisional application 63/374,798, filed on Sep. 7, 2022.
Prior Publication US 2024/0077669 A1, Mar. 7, 2024
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/26 (2006.01)
CPC G02B 6/12004 (2013.01) [G02B 6/262 (2013.01); G02B 6/4239 (2013.01); G02B 2006/12102 (2013.01); G02B 2006/12104 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a package substrate;
a package component bonded to the package substrate, the package component comprising:
an interposer;
an optical die bonded to the interposer, the optical die comprising an optical coupler; and
an integrated circuit die bonded to the interposer adjacent the optical die;
a lens adapter adhered to the optical die with a first optical glue;
a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die; and
an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such that an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.