US 12,411,167 B2
Tension-based socket gimbal for engaging device under test with thermal array
Gregory Cruzan, San Jose, CA (US); Karthik Ranganathan, San Jose, CA (US); Gilberto Oseguera, San Jose, CA (US); Joe Koeth, San Jose, CA (US); Paul Ferrari, San Jose, CA (US); James Hastings, San Jose, CA (US); and Chee Wah Ho, San Jose, CA (US)
Assigned to Advantest Test Solutions, Inc., San Jose, CA (US)
Filed by Advantest Test Solutions, Inc.
Filed on Aug. 16, 2023, as Appl. No. 18/234,635.
Application 18/234,635 is a continuation in part of application No. 17/585,228, filed on Jan. 26, 2022, granted, now 11,835,549.
Prior Publication US 2023/0393188 A1, Dec. 7, 2023
Int. Cl. G01R 31/28 (2006.01); G01R 1/04 (2006.01)
CPC G01R 31/2863 (2013.01) [G01R 1/0466 (2013.01); G01R 31/2877 (2013.01); G01R 31/2889 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A test system for testing a device under test (DUT), the test system comprising:
a socket structure coupled to a spring and operable to receive a DUT;
the spring coupled to a baseplate, wherein the spring is under tension;
the baseplate operable to support the socket structure in a rest position; and
a thermal array comprising arms operable to lift the socket structure to bring the DUT into even and secure contact with the thermal array during operation to cool the DUT when the DUT is disposed in the socket structure.