US 12,411,156 B2
Probe card and manufacturing method thereof
Chia-Hsiang Yu, Hsinchu (TW); You-Chen Lin, Hsinchu (TW); Neng-Kan Chu, Hsinchu (TW); Heng-Rui Chang, Hsinchu (TW); Tien-Chia Lee, Hsinchu (TW); and Wen-Tsung Sung, Hsinchu (TW)
Assigned to SILICON FUTURE MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by Silicon Future Manufacturing Company Ltd., Hsinchu (TW)
Filed on Feb. 22, 2023, as Appl. No. 18/112,789.
Claims priority of application No. 111106613 (TW), filed on Feb. 23, 2022.
Prior Publication US 2023/0266364 A1, Aug. 24, 2023
Int. Cl. G01R 1/073 (2006.01); G01R 1/02 (2006.01); G01R 1/067 (2006.01); G01R 3/00 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01)
CPC G01R 1/07342 (2013.01) [G01R 1/07378 (2013.01); G01R 3/00 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A probe card, comprising:
a circuit substrate having a first surface and a second surface, wherein a through hole penetrates the circuit substrate from the first surface to the second surface;
a space transformer arranged on the second surface corresponding to the through hole and having a probe setting surface opposite to the second surface; and
a first coaxial cable having a first conducting part and a first insulating part, wherein the first coaxial cable is inserted into the through hole, and a first end surface of the first conducting part is flush with the probe setting surface;
wherein the space transformer has an arranging component arranged along a wall of the through hole; the arranging component includes a stop part with an outer diameter larger than the through hole;
wherein the first coaxial cable is inserted into the through hole along a gap between the arranging component and the wall of the through hole.