US 12,411,154 B2
Pneumatic semiconductor socket lid assembly
Jacob Vavra, Minneapolis, MN (US); Ilavarasan M. Palaniappa, Inver Grove Heights, MN (US); and David A. Struyk, Deephaven, MN (US)
Assigned to Ironwood Electronics. Inc.
Filed by Ironwood Electronics, Inc., Eagan, MN (US)
Filed on Sep. 11, 2023, as Appl. No. 18/464,533.
Claims priority of provisional application 63/376,010, filed on Sep. 16, 2022.
Prior Publication US 2024/0094242 A1, Mar. 21, 2024
Int. Cl. G01R 1/04 (2006.01); G01R 1/02 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 19/32 (2006.01); G01R 31/10 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01)
CPC G01R 1/0433 (2013.01) 20 Claims
OG exemplary drawing
 
1. A pneumatic socket lid assembly for a semiconductor test socket used to test an electronic circuit device, comprising:
(a) a cylinder casing having multiple independently sealed pressure chambers, each of said pressure chambers having a fluid source and at least one pneumatically controlled piston rod assembly which is movable within a piston bore opening formed in said cylinder casing in response to changes in fluid pressure within said pressure chamber;
(b) a separate compression plate being individually associated with each of said pressure chambers and movably mounted to said cylinder casing in engaging relation with said piston rod assembly of said associated pressure chamber;
(c) each said compression plate being independently movable relative to other said compression plates in response to movement of said piston rod assembly caused by fluid being introduced from said fluid source to said associated pressure chamber; and
(d) a locking mechanism connected to said cylinder casing for attaching said cylinder casing to the semiconductor test socket to facilitate application of an adjustably variable force through said piston rod assemblies to multiple zones of the electronic circuit device.