US 12,411,003 B2
Apparatus for wafer placement teaching and method for wafer placement teaching using the same
Chung Woo Lee, Suwon-si (KR); Tae Dong Park, Hwaseong-si (KR); Chang Jun Park, Pyeongtaek-si (KR); and Jin Hwan Kim, Hwaseong-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Dec. 15, 2022, as Appl. No. 18/082,572.
Claims priority of application No. 10-2021-0181570 (KR), filed on Dec. 17, 2021.
Prior Publication US 2023/0194239 A1, Jun. 22, 2023
Int. Cl. G01B 11/00 (2006.01); G01B 11/14 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC G01B 11/002 (2013.01) [G01B 11/14 (2013.01); H01L 21/67259 (2013.01); H01L 21/6831 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for wafer placement teaching for adjusting a position of a wafer disposed on an electrostatic chuck, the apparatus comprising:
a laser distance meter disposed above the electrostatic chuck and configured to:
measure a first distance between two points on an upper surface of the electrostatic chuck, without the wafer present on the upper surface of the electrostatic chuck, using a laser; and
measure a second distance between two points on an upper surface of the wafer placed on the upper surface of the electrostatic chuck, wherein a diameter of the upper surface of the wafer is greater than a diameter of the upper surface of the electrostatic chuck;
a controller configured to:
check a relative position of the electrostatic chuck and the wafer disposed on the electrostatic chuck using the first distance and the second distance measured by the laser distance meter,
teach the position of the wafer using the checked relative position of the electrostatic chuck and the wafer, so that the wafer is transferred to a predetermined position using a control robot.