US 12,410,976 B2
Heat exchanger
Sukyoung Lee, Seoul (KR); Sangyeul Lee, Seoul (KR); and Jaeyoung Kim, Seoul (KR)
Assigned to LG ELECTRONICS INC., Seoul (KR)
Filed by LG ELECTRONICS INC., Seoul (KR)
Filed on Oct. 11, 2023, as Appl. No. 18/378,941.
Claims priority of application No. 10-2022-0130774 (KR), filed on Oct. 12, 2022.
Prior Publication US 2024/0125562 A1, Apr. 18, 2024
Int. Cl. F28F 1/12 (2006.01)
CPC F28F 1/128 (2013.01) [F28F 2215/08 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A heat exchanger comprising:
a plurality of heat transfer pipes for guiding a refrigerant; and
a plurality of fins disposed spaced apart from each other to allow air to pass in a first direction,
wherein each fin comprises:
a through-hole through which a respective one of the heat transfer pipes passes;
a corrugated form portion having an inclination with respect to the first direction;
a sheet portion including a surface parallel to the first direction around the through-hole; and
a connecting portion connecting the corrugated form portion and the sheet portion,
wherein the sheet portion includes:
a first length in the first direction; and
a second length in a second direction perpendicular to the first direction, the second length being longer than the first length,
wherein, for each fin, the connecting portion has an inclination with respect to a third direction orthogonal to the first direction and the second direction, and
wherein the connection portion is formed to surround the sheet portion.