| CPC F21V 19/002 (2013.01) [F21V 29/70 (2015.01); H01L 25/0753 (2013.01); F21Y 2105/16 (2016.08); F21Y 2113/20 (2016.08); F21Y 2115/10 (2016.08); F21Y 2115/30 (2016.08)] | 20 Claims |
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1. A hybrid illumination device comprising:
a metal core printed circuit board (MC-PCB) having a thermally conductive metal core layer, one or more patterned, electrically conductive metal layers disposed over the thermally conductive metal core layer, and one or more dielectric layers disposed between the one or more patterned, electrically conductive metal layers, disposed between the thermally conductive metal core layer and a patterned, electrically conductive metal layer of the one or more patterned, electrically conductive layers, or both, wherein the one or more dielectric layers are electrically insulative;
a plurality of electrically isolated LED based illumination sources, each of the plurality of electrically isolated LED based illumination sources having a surface area disposed over the thermally conductive metal core layer, wherein an amount of heat generated by each of the plurality of electrically isolated LED based illumination sources flows through the surface area to the thermally conductive metal core layer, wherein the surface area is not electrically active, wherein at least one of the plurality of electrically isolated LED based illumination sources is electrically coupled to a first of the one or more patterned, electrically conductive metal layers; and
one or more laser diode based illumination sources, each of the plurality of laser diode based illumination sources disposed over the thermally conductive metal core layer, wherein at least one of the one or more laser diode based illumination sources is electrically coupled to the first of the one or more patterned, electrically conductive metal layers or a second of the one or more patterned, electrically conductive metal layers.
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