US 12,410,347 B2
Adhesive composition, and coverlay film and printed circuit board that include the same
Kwangseok Park, Yongin-si (KR); Euidock Ryu, Yongin-si (KR); Inki Jeong, Yongin-si (KR); Subyung Park, Yongin-si (KR); and Dongho Chae, Yongin-si (KR)
Assigned to DOOSAN CORPORATION, Seoul (KR)
Appl. No. 17/910,703
Filed by DOOSAN CORPORATION, Seoul (KR)
PCT Filed Mar. 12, 2021, PCT No. PCT/KR2021/003091
§ 371(c)(1), (2) Date Sep. 9, 2022,
PCT Pub. No. WO2021/182910, PCT Pub. Date Sep. 16, 2021.
Claims priority of application No. 10-2020-0030846 (KR), filed on Mar. 12, 2020.
Prior Publication US 2023/0135423 A1, May 4, 2023
Int. Cl. B32B 41/00 (2006.01); C09J 7/30 (2018.01); C09J 109/02 (2006.01); C09J 163/00 (2006.01); H05K 3/28 (2006.01)
CPC C09J 163/00 (2013.01) [C09J 7/30 (2018.01); C09J 109/02 (2013.01); H05K 3/281 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An adhesive composition, comprising:
(a) an epoxy resin; and
(b) a binder resin including an epoxidized polybutadiene rubber and two or more species of rubber,
wherein the two or more species of rubber comprise an acrylonitrile butadiene rubber (NBR) and an acrylic rubber.