US 12,410,312 B2
Photocurable resin composition for three-dimensional modeling and method for producing article
Chiaki Nishiura, Tokyo (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Appl. No. 17/602,713
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
PCT Filed Mar. 27, 2020, PCT No. PCT/JP2020/014137
§ 371(c)(1), (2) Date Feb. 24, 2022,
PCT Pub. No. WO2020/209105, PCT Pub. Date Oct. 15, 2020.
Claims priority of application No. 2019-075945 (JP), filed on Apr. 11, 2019; and application No. 2020-054575 (JP), filed on Mar. 25, 2020.
Prior Publication US 2024/0384088 A1, Nov. 21, 2024
Int. Cl. C08F 2/46 (2006.01); B33Y 70/00 (2020.01); C08F 2/50 (2006.01); C08F 222/22 (2006.01); C08G 18/10 (2006.01); C08G 61/04 (2006.01); C08L 35/02 (2006.01); B29C 64/135 (2017.01); B29K 23/00 (2006.01); B29K 33/00 (2006.01); B29K 75/00 (2006.01); B29K 79/00 (2006.01); B29K 105/16 (2006.01); B29K 423/00 (2006.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01)
CPC C08L 35/02 (2013.01) [B33Y 70/00 (2014.12); C08F 222/22 (2013.01); C08G 18/10 (2013.01); B29C 64/135 (2017.08); B29K 2023/16 (2013.01); B29K 2033/08 (2013.01); B29K 2033/26 (2013.01); B29K 2075/00 (2013.01); B29K 2079/085 (2013.01); B29K 2105/16 (2013.01); B29K 2423/06 (2013.01); B29K 2995/0073 (2013.01); B29K 2995/0087 (2013.01); B29K 2995/0088 (2013.01); B29K 2995/0089 (2013.01); B29K 2995/0094 (2013.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01)] 20 Claims
 
1. A photo-curable resin composition, the photo-curable resin composition comprising a polyfunctional radical polymerizable compound (A), a monofunctional radical polymerizable compound (B), polyethylene particles (C), and a curing agent (D),
wherein the polyethylene particles (C) has an average particle diameter of 50 μm or less and a viscosity-average molecular weight of 1,500,000 or more,
a content of the polyethylene particles (C) is 5 parts by mass or more and 50 parts by mass or less relative to 100 parts by mass of a total of the polyfunctional radical polymerizable compound (A) and the monofunctional radical polymerizable compound (B), and
a viscosity of the curable resin composition is 50 mPa·s or more and 30,000 mPa·s or less.