| CPC C04B 35/6455 (2013.01) [B22F 7/06 (2013.01); B23B 27/20 (2013.01); C04B 35/5626 (2013.01); C04B 35/6303 (2013.01); C04B 35/638 (2013.01); C22C 1/051 (2013.01); C22C 19/007 (2013.01); C22C 19/07 (2013.01); C22C 29/005 (2013.01); C22C 29/08 (2013.01); E21B 10/46 (2013.01); E21B 10/5673 (2013.01); B22F 2005/001 (2013.01); B22F 2998/10 (2013.01); C04B 2235/3847 (2013.01); C04B 2235/402 (2013.01); C04B 2235/404 (2013.01); C04B 2235/405 (2013.01); C04B 2235/427 (2013.01); C04B 2235/604 (2013.01); C04B 2235/85 (2013.01); C04B 2235/9607 (2013.01)] | 10 Claims |

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1. A method of forming a cutting element, comprising:
providing a supporting substrate comprising WC particles dispersed within a homogenized binder comprising from about 66 wt % Co to about 90 wt % Co, from about 5.0 wt % Al to about 15 wt % Al, from about 0.1 wt % C to about 0.2 wt % C, and from about 5.0 wt % W to about 30 wt % W;
depositing a powder comprising diamond particles directly on the supporting substrate;
subjecting the supporting substrate and the powder to elevated temperatures and elevated pressures to diffuse a portion of the homogenized binder of the supporting substrate into the powder and inter-bond the diamond particles; and
converting the homogenized binder within interstitial spaces between the inter-bonded diamond particles into a thermally stable material substantially free of catalytic Co, without leaching, and comprising κ-carbide precipitates.
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