	US 12,410,066 B2
	Two-dimensional high-entropy metal oxide assembly with high thermal conductivity and preparation method thereof
Lingjie Zhang, Zhejiang (CN); Weiwei Cai, Zhejiang (CN); and Ningzhong Bao, Zhejiang (CN)
Assigned to Zhejiang University, Hangzhou (CN)
Filed by Zhejiang University, Zhejiang (CN)
Filed on Feb. 9, 2022, as Appl. No. 17/667,559.
Application 17/667,559 is a continuation of application No. PCT/CN2021/087663, filed on Apr. 16, 2021.
Claims priority of application No. 202110133141.0 (CN), filed on Feb. 1, 2021.
Prior Publication US 2022/0242745 A1, Aug. 4, 2022
Int. Cl. C01G 51/70 (2025.01)

CPC C01G 51/70 (2013.01) [C01P 2002/52 (2013.01); C01P 2004/10 (2013.01); C01P 2006/32 (2013.01)]

4 Claims

1. A two-dimensional high-entropy metal oxide assembly with high thermal conductivity, wherein the metal oxide assembly has a molecular formula of (Co0.3La0.6Er0.6Y0.7Mn0.4Ga0.4)O, is in a short fiber shape with a length-diameter ratio of the short fiber of 5 to 7, and has a cross section of a regular triangle with a side length of the regular triangle of 100 to 300 nm.