US 12,410,053 B1
Embedded digital sensor structure
Andreas Bibl, Los Altos, CA (US); Dariusz Golda, Portola Valley, CA (US); and Patrick M. Smith, Palo Alto, CA (US)
Assigned to Tacta Systems Inc., Palo Alto, CA (US)
Filed by Tacta Systems Inc., Palo Alto, CA (US)
Filed on Nov. 26, 2024, as Appl. No. 18/960,184.
Application 18/960,184 is a continuation of application No. 18/959,288, filed on Nov. 25, 2024.
Claims priority of provisional application 63/676,840, filed on Jul. 29, 2024.
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); G08B 6/00 (2006.01)
CPC B81B 7/0054 (2013.01) [B81C 1/00325 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81C 2203/0154 (2013.01); G08B 6/00 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An embedded sensor structure comprising:
a sensor package including:
an integrated circuit (IC) die including a front side and a back side; and
a sensor die including a top side and a bottom side that is bonded to the front side of the IC die;
wherein the sensor die includes a diaphragm that is deflectable toward a cavity;
a planarization layer laterally surrounding the sensor package; and
a metal routing to the top side of the sensor die, the metal routing spanning over the planarization layer.