US 12,409,632 B2
Polymer film and laminate
Yasuyuki Sasada, Shizuoka (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on May 16, 2023, as Appl. No. 18/317,933.
Application 18/317,933 is a continuation of application No. PCT/JP2021/042879, filed on Nov. 24, 2021.
Claims priority of application No. 2020-194651 (JP), filed on Nov. 24, 2020; and application No. 2021-188869 (JP), filed on Nov. 19, 2021.
Prior Publication US 2023/0278317 A1, Sep. 7, 2023
Int. Cl. B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01)
CPC B32B 15/09 (2013.01) [B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 2250/03 (2013.01); B32B 2305/55 (2013.01)] 14 Claims
 
1. A polymer film comprising:
a layer A; and
a layer B on at least one surface of the layer A,
wherein the layer B contains a polymer having a dielectric loss tangent of 0.005 or less with a measurement frequency of 10 GHz and a compound having a functional group, and
the functional group is at least one group selected from the group consisting of a covalent-bondable group, an ion-bondable group, a hydrogen-bondable group, a dipole-interactable group, and a curing reactive group,
the compound having the functional group is a compound which interacts with, is bonded to, or forms an entanglement with the polymer having the dielectric loss tangent of 0.005 or less,
the polymer having the dielectric loss tangent of 0.005 or less with the measurement frequency of 10 GHz and the compound having the functional group are compatible with each other,
a difference between an SP value of the polymer having the dielectric loss tangent of 0.005 or less, which is determined by Hoy method, and an SP value of the compound having the functional group, which is determined by the Hoy method, is 5 MPa0.5 or less.