| CPC B29C 65/4825 (2013.01) [B29C 2791/006 (2013.01)] | 9 Claims |
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1. A bonding method of substrates for bonding a first substrate and a second substrate, comprising:
placing the first substrate on a holder in a confined chamber;
evacuating air from the confined chamber to vacuum the confined chamber to a predetermined low-pressure value;
placing the second substrate on a top of the first substrate;
pressing the second substrate onto the first substrate;
allowing an outside atmosphere air to enter the confined chamber by a first flow coefficient; and allowing the outside atmosphere air to enter the confined chamber by a second flow coefficient;
wherein the second flow coefficient is greater than the first flow coefficient.
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