US 12,409,530 B2
Bonded abrasive with low wetting bond material
Qing Wang, Shanghai (CN); Guangyong Lin, Shrewsbury, MA (US); Nilanjan Sarangi, Shrewsbury, MA (US); Zhenyu Luo, Shanghai (CN); and Lu Lu, Shanghai (CN)
Assigned to SAINT-GOBAIN ABRASIVES, INC., Worcester, MA (US); and SAINT-GOBAIN SURFACE SOLUTIONS FRANCE, Conflans-Sainte-Honorine (FR)
Filed by SAINT-GOBAIN ABRASIVES, INC., Worcester, MA (US); and SAINT-GOBAIN ABRASIFS, Conflans-Sainte-Honorine (FR)
Filed on Nov. 3, 2023, as Appl. No. 18/501,651.
Claims priority of application No. 202211376873.3 (CN), filed on Nov. 4, 2022.
Prior Publication US 2024/0149398 A1, May 9, 2024
Int. Cl. B24D 18/00 (2006.01); B24D 5/02 (2006.01)
CPC B24D 5/02 (2013.01) [B24D 18/0072 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An abrasive article comprising:
a body comprising:
a bond material comprising an inorganic material;
abrasive particles contained in a bond material;
a MOR/EMOD ratio of at least 0.92; a bond vol % of less than 18%, a porosity of at least 1 vol % and not greater than 65 vol %, and
wherein the body further comprises at least one of:
a) an average Bond Post Area (BPA) of not greater than 2400 microns2;
b) an average Bond Post Count (BPC) of at least 140 per 1.536 mm2;
c) an average bond wetting radius of at least 30 microns; and
d) a combination of a) and b).