| CPC B23K 26/0624 (2015.10) [B23K 26/0648 (2013.01); B23K 26/352 (2015.10); B23K 26/53 (2015.10); B32B 5/16 (2013.01); B32B 5/30 (2013.01); B32B 7/025 (2019.01); C03B 32/02 (2013.01); C03C 10/00 (2013.01); C03C 23/0025 (2013.01); B23K 2103/42 (2018.08); B23K 2103/50 (2018.08); B23K 2103/52 (2018.08); B23K 2103/54 (2018.08); C03B 27/012 (2013.01); C03C 1/00 (2013.01); C03C 10/0027 (2013.01); Y10T 428/24942 (2015.01)] | 22 Claims |

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1. A method, comprising:
utilizing a laser processing device to produce modifications in or on a transparent workpiece, wherein the laser processing device has a short pulse or ultrashort pulse laser that emits laser radiation having a wavelength in the transparency range of the workpiece and which has a beam-shaping optical unit for beam shaping for focusing the laser radiation on the transparent workpiece; and
wherein the transparent workpiece is composed of a material that has a plurality of phases, of which at least two phases have different dielectric constants, the at least two phases having different dielectric constants comprising one phase and a surrounding phase each having a respective dielectric constant so there are two different dielectric constants, of which in turn the one phase is an embedded phase comprising particles substantially surrounded by the surrounding phase, and wherein a product of a volume of the particles specified in cubic nanometers and the ratio of the absolute value of the difference of the two different dielectric constants to the dielectric constant of the surrounding phase is greater than 500.
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