US 12,082,447 B2
OLED panel with inorganic pixel encapsulating barrier
Ji-young Choung, Hwaseong-si (KR); Dieter Haas, San Jose, CA (US); Yu Hsin Lin, Zhubei (TW); Jungmin Lee, Santa Clara, CA (US); Seong Ho Yoo, San Ramon, CA (US); and Si Kyoung Kim, Gwangju-si (KR)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 10, 2023, as Appl. No. 18/314,915.
Application 18/314,915 is a continuation of application No. 18/049,868, filed on Oct. 26, 2022, granted, now 11,690,255.
Application 18/049,868 is a continuation of application No. 18/049,825, filed on Oct. 26, 2022, granted, now 11,690,254.
Application 18/049,825 is a continuation of application No. 17/498,482, filed on Oct. 11, 2021, granted, now 11,476,313, issued on Oct. 18, 2022.
Application 17/498,482 is a continuation of application No. 17/193,321, filed on Mar. 5, 2021, abandoned.
Application 17/498,482 is a continuation of application No. 17/193,347, filed on Mar. 5, 2021, granted, now 11,610,952, issued on Mar. 21, 2023.
Claims priority of provisional application 63/084,445, filed on Sep. 28, 2020.
Claims priority of provisional application 63/075,028, filed on Sep. 4, 2020.
Claims priority of provisional application 63/075,025, filed on Sep. 4, 2020.
Prior Publication US 2023/0284484 A1, Sep. 7, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H10K 59/122 (2023.01); H10K 50/84 (2023.01); H10K 50/844 (2023.01); H10K 59/12 (2023.01); H10K 71/00 (2023.01)
CPC H10K 59/122 (2023.02) [H10K 50/84 (2023.02); H10K 50/844 (2023.02); H10K 71/00 (2023.02); H10K 59/1201 (2023.02)] 16 Claims
OG exemplary drawing
 
1. A method of forming a device, comprising:
positioning a substrate having:
an anode,
adjacent pixel-defining layer (PDL) structures disposed over the substrate, and
inorganic overhang structures defining wells of sub-pixels disposed over an upper surface of the PDL structures, the inorganic overhang structures having an upper portion having a bottom surface contacting and wider than a top surface of a lower portion;
depositing an organic light-emitting diode (OLED) material over the anode;
depositing a cathode over the OLED material, the cathode extending under the inorganic overhang structures adjacent to each sub-pixel and contacting a sidewall of the lower portion of the inorganic overhang structures, a cathode material of the cathode is different from a material of the upper portion;
depositing a first encapsulation layer over the cathode, the first encapsulation layer extends under at least a portion of the inorganic overhang structures past the cathode along the sidewall of the lower portion, and contacts the bottom surface of the upper portion of the inorganic overhang structures; and
depositing a second encapsulation layer over the first encapsulation layer, wherein the second encapsulation layer is disposed within a well of each sub pixel and on the upper portion of the inorganic overhang structures.