| CPC H10K 50/87 (2023.02) [H10K 50/115 (2023.02); H10K 59/38 (2023.02); H10K 71/00 (2023.02)] | 9 Claims |
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1. A manufacturing method of a display device comprising:
forming an insulation layer under a first substrate comprising a first removal part and a first peripheral part adjacent to the first removal part;
forming a pixel on the first substrate;
removing a second removal part of the insulation layer which overlaps the first removal part in a plan view;
removing the first removal part;
forming a first heat dissipation layer in the first opening part of the first substrate, the first opening part being formed by the removing of the first removal part; and
forming a second heat dissipation layer in a second opening part of the insulation layer, the second opening part being formed by the removing of the second removal part.
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