US 12,082,416 B2
Integrated assemblies and methods of forming integrated assemblies
Byeung Chul Kim, Boise, ID (US); Davide Resnati, Vimercate (IT); Gianpietro Carnevale, Bottanuco (IT); and Shyam Surthi, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jul. 30, 2021, as Appl. No. 17/389,864.
Prior Publication US 2023/0034157 A1, Feb. 2, 2023
Int. Cl. H10B 43/27 (2023.01)
CPC H10B 43/27 (2023.02) 47 Claims
OG exemplary drawing
 
1. An integrated assembly, comprising:
a stack of alternating insulative levels and conductive levels;
a pillar of channel material extending through the stack, the conductive levels having terminal regions adjacent the pillar and laterally offset from the pillar;
charge-storage-material-segments adjacent the conductive levels of the stack, and being between the channel material and the terminal regions; vertically-neighboring charge-storage-material-segments being spaced from one another by intervening regions aligned with the insulative levels;
tunneling material between the charge-storage-material-segments and the channel material;
charge-blocking-material between the charge-storage-material-segments and the terminal regions; and
ribbons of dielectric material extending vertically across the insulative levels and being laterally inset relative to the terminal regions; the ribbons having first regions adjacent the conductive levels and having second regions between the first regions; the second regions being laterally inset relative to the first regions such that innermost surfaces of the ribbons have convex configurations.