CPC H10B 41/27 (2023.02) [H01L 23/5226 (2013.01); H10B 41/35 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H01L 24/32 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 2224/32145 (2013.01); H01L 2924/14511 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a substrate that includes a cell array region and a connection region;
an electrode structure that extends in a first direction on the substrate, the electrode structure including a plurality of electrodes that are vertically stacked, the electrodes having pad sections that are arranged stepwise on the connection region;
a first contact plug connected to a first one of the pad sections;
a pair of first vertical structures that penetrate the first one of the pad sections and are spaced apart from each other in the first direction by a first distance;
a second contact plug connected to a second one of the pad sections and having a vertical length that is greater than a vertical length of the first contact plug; and
a pair of second vertical structures that penetrate the second one of the pad sections and are spaced apart from each other in the first direction by a second distance,
wherein the second distance is greater than the first distance.
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