US 12,082,378 B2
Thermally conductive shock absorbers for electronic devices
Aleksander Magi, Portland, OR (US); Jeff Ku, Taipei (TW); Juha Paavola, Hillsboro, OR (US); and Prakash Kurma Raju, Bangalore (IN)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 22, 2020, as Appl. No. 17/131,137.
Prior Publication US 2021/0112685 A1, Apr. 15, 2021
Int. Cl. H05K 7/20 (2006.01); F16F 7/12 (2006.01)
CPC H05K 7/20454 (2013.01) [F16F 7/128 (2013.01); F16F 2222/025 (2013.01); F16F 2230/0023 (2013.01); F16F 2230/48 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing;
a hardware component positioned inside the housing;
a thermally conductive shock absorber located between an inner surface of the housing and the hardware component, the thermally conductive shock absorber including:
an impact absorbing body, the impact absorbing body having an arcuate surface and a planar surface to define a cavity; and
a thermal conductive material in contact with at least a portion of the arcuate surface of the impact absorbing body.