US 12,082,376 B2
Electronic control device
Minami Teranishi, Tokyo (JP); Shinya Kawakita, Hitachinaka (JP); and Hideyuki Sakamoto, Hitachinaka (JP)
Assigned to Hitachi Astemo, Ltd., Hitachinaka (JP)
Appl. No. 17/794,479
Filed by Hitachi Astemo, Ltd., Hitachinaka (JP)
PCT Filed Dec. 11, 2020, PCT No. PCT/JP2020/046392
§ 371(c)(1), (2) Date Jul. 21, 2022,
PCT Pub. No. WO2021/149393, PCT Pub. Date Jul. 29, 2021.
Claims priority of application No. 2020-008785 (JP), filed on Jan. 22, 2020.
Prior Publication US 2023/0069331 A1, Mar. 2, 2023
Int. Cl. G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/20409 (2013.01) 12 Claims
OG exemplary drawing
 
1. An electronic control device comprising:
an enclosure including a first enclosure having an assembly opening and a second enclosure covering the entire assembly opening, the enclosure having a communication opening communicating with the assembly opening;
a circuit board accommodated in the enclosure;
an integrated circuit element mounted on the circuit board; and
a heat dissipating shield member thermally coupled to the integrated circuit element and grounded,
wherein
the heat dissipating shield member includes
an inner portion accommodated inside the enclosure and thermally coupled to the integrated circuit element and
an outer portion extending to an outside of the enclosure via the communication opening.