US 12,082,375 B2
Circuit structure
Yuki Fujimura, Mie (JP); and Hitoshi Takeda, Mie (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 17/778,725
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Nov. 6, 2020, PCT No. PCT/JP2020/041500
§ 371(c)(1), (2) Date May 20, 2022,
PCT Pub. No. WO2021/106523, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-213583 (JP), filed on Nov. 26, 2019.
Prior Publication US 2022/0418085 A1, Dec. 29, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2039 (2013.01) [H05K 2201/10272 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A circuit structure comprising:
a heat generating component;
a bus bar connected to a connection portion of the heat generating component;
a case for accommodating the heat generating component and the bus bar;
an elastic thermally conductive member that is configured to come into thermal contact with the bus bar, wherein,
with respect to an upward direction of the case, the elastic thermally conductive member is positioned below both the heat generating component and the bus bar;
a pressing portion that is provided on the case and causes the bus bar to come into contact with the thermally conductive member; and
a reinforcing wall portion that protrudes outside of the case and reinforces the pressing portion.