CPC H05K 7/2039 (2013.01) [H05K 1/0203 (2013.01)] | 10 Claims |
1. A heatsink, comprising:
a body;
a plurality of thermal fin arrays defined by and/or extending from the body;
a phase change material disposed in contact with the one or more fin arrays, the phase change material configured to be a first phase in a cool state and a second phase in a heated state, wherein the phase change material is configured to be cooled back to the solid state; and
a plurality of reservoirs defined by the body configured to be in fluid communication with the plurality of thermal fin arrays, a respective fin array of the plurality of fin arrays disposed in a respective reservoir of the plurality of reservoirs, wherein the phase change material is disposed within the plurality of reservoirs and configured to create a larger heat absorbing mass of phase change material, wherein the plurality of reservoirs and the plurality of thermal fin arrays are in fluid communication via a plurality of channels, wherein the plurality of thermal fin arrays are spaced apart from each other, wherein the plurality of thermal fin arrays and the plurality of reservoirs are in fluid communication with each other such that all thermal fin arrays and all reservoirs share the same volume of phase change material, wherein the plurality of channels are machined around the plurality of fin arrays, wherein the plurality of reservoirs are machined at various locations.
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