US 12,082,368 B2
Cooling device and method of manufacturing the same
Frank H. Adam, Dublin (IE); Klaus Kaufmann, Dublin (IE); and Tobias Merten, Dublin (IE)
Assigned to Aptiv Technologies AG, Schaffhausen (CH)
Filed by Aptiv Technologies AG, Schaffhausen (CH)
Filed on Dec. 30, 2021, as Appl. No. 17/646,614.
Claims priority of application No. 21150125 (EP), filed on Jan. 4, 2021; and application No. 21205717 (EP), filed on Oct. 29, 2021.
Prior Publication US 2022/0217868 A1, Jul. 7, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 7/20254 (2013.01) [H05K 1/0203 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a plurality of cooling plate assemblies, the cooling plate assemblies each comprising:
a cooling plate for mating to at least one high-power electronic component mounted on a circuit board, the cooling plate shaped to expose one or more other electronic components mounted to the circuit board when the cooling plate is mated with the at least one high-power electronic component; and
an enclosure mounted to the cooling plate for defining a coolant transport path over at least part of a surface thereof; and
one or more conduits connecting between the cooling plate assemblies for fluid communication between their respective coolant transport paths, the conduits are flexible such that positions of the cooling plates are adjustable for mating to respective high-power electronic components in different planes.