a nonconductive substrate comprising a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface;

a conductive layer hermetically sealed to the first major surface of the substrate and over the opening;

a conductor block disposed in the opening and extending beyond the second major surface of the substrate, wherein the conductor block is electrically connected to the conductive layer;

an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer; and

a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, wherein the electronic device is disposed within a cavity of the cover.