US 12,082,347 B2
Method for printing traces on a substrate and an additive manufacturing apparatus therefor
Lukasz Witczak, Łódź (PL); Iwona Grądzka-Kurzaj, Wrocław (PL); Aneta Wiatrowska, dolnośląskie (PL); Karolina Fiączyk, Wrocław (PL); and Filip Granek, Mrozów (PL)
Assigned to XTPL S.A., Wroclaw (PL)
Filed by XTPL S.A., Wrocław (PL)
Filed on Jun. 30, 2023, as Appl. No. 18/345,175.
Claims priority of provisional application 63/375,760, filed on Sep. 15, 2022.
Prior Publication US 2024/0098903 A1, Mar. 21, 2024
Int. Cl. H05K 3/12 (2006.01)
CPC H05K 3/1241 (2013.01) 21 Claims
OG exemplary drawing
 
1. A method for printing traces on a substrate, the method comprising:
measuring at least two first location points on the substrate for a first trace and at least two second location points on the substrate for a second trace,
wherein the first trace and the second trace traverse at least two surfaces of the substrate, including a first surface of the substrate and a second surface of the substrate,
wherein the first surface forms an angle with the second surface of less than 180 degrees, and
wherein at least one of the at least two first location points is on the first surface and at least one of the at least two first location points is on the second surface;
estimating at least two third location points on the substrate for a third trace based on correlating the at least two first location points with the at least two second location points, wherein the third trace is intermediate the first trace and the second trace;
generating machine path instructions for forming the first trace, the second trace, and the third trace based on the at least two first location points, the at least two second location points, and the at least two third location points; and
automatically forming the first trace, the second trace, and the third trace on the substrate based on the machine path instructions.