| CPC H05K 3/0011 (2013.01) [H05K 1/0271 (2013.01); H05K 1/05 (2013.01); H05K 2201/093 (2013.01); H05K 2201/09372 (2013.01); H05K 2201/10204 (2013.01)] | 14 Claims |
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1. A wiring board comprising:
a first insulating layer;
a pad formed on one surface of the first insulating layer;
a second insulating layer, formed on the one surface of the first insulating layer, and including an opening exposing the pad;
a reinforcing metal layer formed in contact with the first insulating layer, and provided around the pad so as to be separated from the pad in a plan view; and
a power supply pattern formed on the one surface of the first insulating layer, wherein:
the pad is disposed inside the opening without making contact with the second insulating layer,
an end, on a side of the first insulating layer, in a portion of an inner side surface of the opening of the second insulating layer makes contact with the reinforcing metal layer,
an end, on the side of the first insulating layer, in another portion of the inner side surface of the opening of the second insulating layer makes contact with the one surface of the first insulating layer, and
the reinforcing metal layer is electrically insulated from the power supply pattern.
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