US 12,082,335 B2
Superconducting flex circuit boards having metal structures for improved interfacing characteristics
John Martinis, Santa Barbara, CA (US); Xiaojun Trent Huang, Santa Barbara, CA (US); and Bob Benjamin Buckley, Santa Barbara, CA (US)
Assigned to GOOGLE LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Sep. 16, 2021, as Appl. No. 17/476,612.
Claims priority of provisional application 63/079,263, filed on Sep. 16, 2020.
Prior Publication US 2022/0087012 A1, Mar. 17, 2022
Int. Cl. H05K 1/02 (2006.01); G06N 10/00 (2022.01); H03K 5/01 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01)
CPC H05K 1/0219 (2013.01) [G06N 10/00 (2019.01); H03K 5/01 (2013.01); H05K 1/028 (2013.01); H05K 1/09 (2013.01); H05K 1/116 (2013.01); H05K 3/06 (2013.01); H05K 3/188 (2013.01); H05K 2201/0154 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flex circuit board for use in transmitting signals in a quantum computing system, the flex circuit board comprising:
at least one dielectric layer; and
at least one superconducting layer disposed on a surface of the at least one dielectric layer, the at least one superconducting layer comprising a superconducting material, the superconducting material being superconducting at a temperature less than about 3 kelvin;
wherein the flex circuit board has at least one metal structure that is electroplated onto the at least one superconducting layer, the at least one metal structure is configured to couple the at least one superconducting layer to another structure that is external to the flex circuit board, and the at least one metal structure is a via plate, the via plate coating a via extending through at least the at least one dielectric layer and the at least one superconducting layer.