US 12,082,334 B2
Devices and methods to improve thermal conduction from SMT and chip on board components to chassis heat sinking
John Dickey, Caledonia, IL (US); and Kevin Kilroy, Gilbert, IL (US)
Assigned to Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Apr. 14, 2022, as Appl. No. 17/720,685.
Prior Publication US 2023/0337353 A1, Oct. 19, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/0207 (2013.01) [H05K 1/021 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 3/107 (2013.01); H05K 2201/0302 (2013.01); H05K 2201/032 (2013.01); H05K 2201/10166 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A circuit board assembly comprising:
a circuit board portion having a stepped recess formed therein;
an electrically and thermally conductive insert, shaped to fit in the recess formed in the circuit board portion;
an electrically and thermally conductive layer adapted and configured to interface with an external chassis; and
a thermally conductive electrically insulative portion interposed between the electrically and thermally conductive insert and the electrically and thermally conductive layer, adapted and configured to conduct heat from the electrically and thermally conductive insert to the electrically and thermally conductive layer without conducting electricity.