US 12,082,333 B2
Electronic module, method for producing an electronic module, and industrial plant
Hubert Baueregger, Kissing (DE); Albrecht Donat, Dachsbach (DE); Axel Ganster, Schwindegg (DE); Franziska Lambrecht, Rückersdorf (DE); Markus Lasch, Munich (DE); Stefan Stegmeier, Munich (DE); Erik Weisbrod, Munich (DE); and Jörg Zapf, Munich (DE)
Assigned to SIEMENS AKTIENGESELLSCHAFT, Munich (DE)
Appl. No. 17/801,358
Filed by Siemens Aktiengesellschaft, Munich (DE)
PCT Filed Jan. 28, 2021, PCT No. PCT/EP2021/051899
§ 371(c)(1), (2) Date Aug. 22, 2022,
PCT Pub. No. WO2021/170332, PCT Pub. Date Sep. 2, 2021.
Claims priority of application No. 10 2020 202 607.6 (DE), filed on Feb. 28, 2020; and application No. 20182203 (EP), filed on Jun. 25, 2020.
Prior Publication US 2023/0074572 A1, Mar. 9, 2023
Int. Cl. H05K 1/02 (2006.01); H01L 23/367 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/0203 (2013.01) [H01L 23/367 (2013.01); H05K 3/34 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic module comprising:
a circuit carrier comprising an electrically conductive thick film with a thickness of at least 0.5 millimeter;
a plurality of thermally conductive elements connected to the thick film and materially bonded to one another by a thermally conductive material;
wherein the thermally conductive elements have a base area with rotational symmetry.