US 12,082,332 B2
Thermal management systems having signal transfer routing for use with electronic devices
Juha Paavola, Hillboro, OR (US); Sami Heinisuo, Portland, OR (US); and Kari Mansukoski, Hillsboro, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 22, 2020, as Appl. No. 17/131,166.
Prior Publication US 2021/0112654 A1, Apr. 15, 2021
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/0201 (2013.01) [H05K 7/20163 (2013.01); H05K 7/2039 (2013.01); G06F 1/203 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing to house a first electronic component and a second electronic component;
a circuit board inside the housing, the circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component;
a thermal conductor adjacent the circuit board, the thermal conductor to dissipate heat generated by the processor, the thermal conductor to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component; and
a spring connector to couple the second signal path between the thermal conductor and the processor.