CPC H04N 23/55 (2023.01) [G02B 1/115 (2013.01); H04N 23/54 (2023.01)] | 18 Claims |
1. A camera module, comprising:
an imaging lens assembly;
an image sensor disposed on an image surface of the imaging lens assembly; and
an optical plate disposed between the imaging lens assembly and the image sensor, comprising:
a substrate having an object-side surface and an image-side surface, the object-side surface facing towards an object side, the image-side surface facing towards an image side, and the object-side surface being parallel with the image-side surface; and
at least one anti-reflection layer disposed on the image-side surface of the substrate, the at least one anti-reflection layer comprising a nanocrystal structure layer and an optical-connecting layer, wherein the nanocrystal structure layer comprises a metal oxide crystal, the optical-connecting layer connects the substrate and the nanocrystal structure layer, the nanocrystal structure layer is physically contacted with the optical-connecting layer, and the nanocrystal structure layer is arranged irregularly;
wherein a material refractive index of the nanocrystal structure layer is Nc, a material refractive index of the optical-connecting layer is Nf, a height of the nanocrystal structure layer is Hc, a thickness of the optical-connecting layer is Hf, a total height of the anti-reflection layer is H, and the following conditions are satisfied:
Nf<Nc;
Hf+Hc=H; and
Hf<Hc.
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