US 12,081,849 B2
Photosensitive assembly, camera module and manufacturing method thereof
Zhongyu Luan, Zhejiang (CN); Zhen Huang, Zhejiang (CN); Li Liu, Zhejiang (CN); Hongfeng Gan, Zhejiang (CN); Tinghua Li, Zhejiang (CN); and Xinxiang Sun, Zhejiang (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD, Zhejiang (CN)
Appl. No. 17/635,121
Filed by NINGBO SUNNY OPOTECH CO., LTD, Zhejiang (CN)
PCT Filed Jul. 8, 2020, PCT No. PCT/CN2020/100862
§ 371(c)(1), (2) Date Feb. 14, 2022,
PCT Pub. No. WO2021/027445, PCT Pub. Date Feb. 18, 2021.
Claims priority of application No. 201910753723.1 (CN), filed on Aug. 15, 2019.
Prior Publication US 2022/0303436 A1, Sep. 22, 2022
Int. Cl. H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01)
CPC H04N 23/54 (2023.01) [H04N 23/55 (2023.01); H04N 23/57 (2023.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/1316 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A photosensitive assembly, characterized by comprising:
a circuit board having a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, wherein the first surface has a protrusion structure, and the protrusion structure is distributed on a chip attachment area of the circuit board;
a photosensitive chip attached to the first surface through an adhesive, wherein the adhesive is arranged at least between a top surface of the protrusion structure and a bottom surface of the photosensitive chip; and
a metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner;
wherein the protrusion structure includes a first annular dam on an outer side and a second annular dam on an inner side, and a protrusion height of the first annular dam is greater than a protrusion height of the second annular dam.