US 12,081,848 B2
Multifunctional heatsink
Nicholas Vitale, Foster City, CA (US)
Assigned to GoPro, Inc., San Mateo, CA (US)
Filed by GoPro, Inc., San Mateo, CA (US)
Filed on Sep. 2, 2022, as Appl. No. 17/901,990.
Application 17/901,990 is a continuation in part of application No. 17/893,673, filed on Aug. 23, 2022.
Prior Publication US 2024/0073500 A1, Feb. 29, 2024
Int. Cl. H04N 23/52 (2023.01); H04N 23/51 (2023.01)
CPC H04N 23/52 (2023.01) [H04N 23/51 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An image capture device, comprising: a housing; a heatsink that forms an integral portion of the housing and is configured to draw heat from a heat generating component; a circuit board enclosed by the housing and comprising a chip; an image sensor separated from the circuit board, configured to generate heat, and connected with the heatsink through a conductor; and a gasket that connects the heatsink and the circuit board, wherein the gasket encloses sides of the chip and the heatsink encloses a top of the chip so that electromagnetic interference from the chip does not affect other components the image sensor.