| CPC H04M 1/0264 (2013.01) [H04N 23/52 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01)] | 22 Claims |
|
1. An imaging device, comprising:
an optical element;
a metallic shielding enclosure electrically connected to ground, wherein the optical element is partially located within the metallic shielding enclosure;
an electrically conductive coating layer applied on a surface of the optical element that is outside the metallic shielding enclosure, wherein the electrically conductive coating layer is electrically connected to the metallic shielding enclosure; and
at least one electrically conductive bridge, wherein the electrically conductive coating layer is electrically connected to the metallic shielding enclosure through the at least one electrically conductive bridge.
|