US 12,081,246 B2
Electronic device including 5G antenna module
Jaehyung Kim, Suwon-si (KR); Jinkyu Bang, Suwon-si (KR); and Jaebong Chun, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Appl. No. 17/268,753
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
PCT Filed Sep. 3, 2019, PCT No. PCT/KR2019/011333
§ 371(c)(1), (2) Date Jul. 13, 2021,
PCT Pub. No. WO2020/050591, PCT Pub. Date Mar. 12, 2020.
Claims priority of application No. 10-2018-0106738 (KR), filed on Sep. 6, 2018.
Prior Publication US 2022/0200640 A1, Jun. 23, 2022
Int. Cl. H04B 1/00 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 21/20 (2006.01); H04B 1/40 (2015.01); H04M 1/02 (2006.01)
CPC H04B 1/0067 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 21/20 (2013.01); H04B 1/40 (2013.01); H04M 1/026 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a first printed circuit board (PCB) including a non-conductive region and a conductive region, the conductive region operating as a ground;
a first wireless communication circuit disposed on the first PCB; and
5th generation (5G) antenna circuitry disposed adjacent to the first PCB,
wherein the 5G antenna circuitry comprises:
at least one second PCB including an antenna array and a conductive layer, the conductive layer operating as a ground of the antenna array; and
a second wireless communication circuit electrically connected to the antenna array,
wherein the at least one second PCB includes a first portion and a second portion having a predetermined angle with the first portion, the first portion having a first rectangular shape and the second portion having a second rectangular shape, a long edge of first rectangular shape of the first portion extending a first distance in a first direction and a long edge of the second rectangular shape of the second portion extending a second distance different from the first distance in a second direction perpendicular to the first direction,
wherein the first portion is disposed adjacent to the non-conductive region,
wherein a part of the second portion is disposed adjacent to the conductive region and a remaining part of the second portion is disposed adjacent to the non-conductive region,
wherein a second point of the part of the second portion is electrically connected to the conductive region of the first PCB,
wherein the first wireless communication circuit is electrically connected to a first point of the conductive layer included in the first portion,
wherein the first wireless communication circuit is configured to transmit or receive a first RF signal in a first frequency band by using the conductive region and at least part of the conductive layer, and
wherein the second wireless communication circuit is configured to transmit or receive a second RF signal in a second frequency band by using the antenna array.