CPC H03H 9/547 (2013.01) [H03H 9/02031 (2013.01); H03H 9/562 (2013.01); H03H 9/568 (2013.01); H03H 9/706 (2013.01)] | 19 Claims |
1. A radio-frequency module comprising:
a packaging substrate;
a die mounted on the packaging substrate and including a radio-frequency integrated circuit; and
a filter device implemented on the packaging substrate and configured to support operation of the radio-frequency integrated circuit, the filter device including a filter substrate and a filter circuit implemented on the filter substrate, the filter device further including a first assembly having one or more bulk acoustic wave (BAW) resonators implemented electrically between an input node and an output node, and configured to filter a signal, the filter device further including a second assembly having one or more surface acoustic wave (SAW) resonators implemented electrically relative to the first assembly, and configured to suppress one or more harmonics resulting from the filtering of the signal by the first assembly.
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