US 12,081,193 B2
Acoustic wave device and acoustic wave module including the same
Koichiro Kawasaki, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Sep. 7, 2023, as Appl. No. 18/243,201.
Application 18/243,201 is a continuation of application No. 17/951,256, filed on Sep. 23, 2022, granted, now 11,764,754.
Application 17/951,256 is a continuation of application No. 16/789,460, filed on Feb. 13, 2020, granted, now 11,489,509, issued on Nov. 1, 2022.
Application 16/789,460 is a continuation of application No. PCT/JP2018/025823, filed on Jul. 9, 2018.
Claims priority of application No. 2017-166611 (JP), filed on Aug. 31, 2017.
Prior Publication US 2023/0421128 A1, Dec. 28, 2023
Int. Cl. H03H 9/02 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01)
CPC H03H 9/1092 (2013.01) [H03H 9/059 (2013.01); H03H 9/25 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An acoustic wave device comprising:
a piezoelectric substrate;
an interdigital transducer (IDT) electrode on the piezoelectric substrate;
an outer peripheral support layer on the piezoelectric substrate and surrounding a region in which the IDT electrode is provided when the acoustic wave device is seen in plan view from a thickness direction of the piezoelectric substrate;
a cover portion supported by the outer peripheral support layer and disposed above the IDT electrode;
a protective layer on the cover portion and including a portion in which a through-hole is provided;
a wiring electrode on the piezoelectric substrate and connected to the IDT electrode;
a first conductive portion between the cover portion and the protective layer;
a second conductive portion connected to the wiring electrode and the first conductive portion;
a third conductive portion at least a portion of which is disposed in the through-hole and is connected to the first conductive portion; and
an internal support layer between the cover portion and the piezoelectric substrate in a region that is surrounded by the outer peripheral support layer when the acoustic wave device is seen in plan view from the thickness direction of the piezoelectric substrate; wherein
the internal support layer includes a first portion extending in a first direction and a second portion extending in a second direction different from the first direction; and
at least a portion of the internal support layer overlaps the through-hole when the acoustic wave device is seen in plan view from the thickness direction of the piezoelectric substrate.