US 12,081,189 B2
Packaged bulk acoustic wave resonator on acoustic wave device
Keiichi Maki, Suita (JP); Hironori Fukuhara, Ibaraki (JP); and Rei Goto, Osaka (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Nov. 18, 2020, as Appl. No. 16/951,545.
Claims priority of provisional application 62/938,539, filed on Nov. 21, 2019.
Claims priority of provisional application 62/938,544, filed on Nov. 21, 2019.
Claims priority of provisional application 62/938,556, filed on Nov. 21, 2019.
Prior Publication US 2021/0281246 A1, Sep. 9, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/13 (2006.01); H03H 9/145 (2006.01); H03H 9/17 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H03H 9/72 (2006.01); H04B 1/38 (2015.01)
CPC H03H 9/02574 (2013.01) [H03H 9/02015 (2013.01); H03H 9/02102 (2013.01); H03H 9/02228 (2013.01); H03H 9/02834 (2013.01); H03H 9/105 (2013.01); H03H 9/132 (2013.01); H03H 9/145 (2013.01); H03H 9/173 (2013.01); H03H 9/175 (2013.01); H03H 9/25 (2013.01); H03H 9/6406 (2013.01); H03H 9/6443 (2013.01); H03H 9/6483 (2013.01); H03H 9/725 (2013.01); H04B 1/38 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaged hybrid filter component comprising:
an acoustic wave device including a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer;
a support layer located over the interdigital transducer electrode;
a bulk acoustic wave resonator supported by the support layer, the bulk acoustic wave resonator being included in an acoustic wave filter arranged to filter a radio frequency signal;
a cap layer encapsulating the bulk acoustic wave resonator; and
an external via in electrical communication with the bulk acoustic wave resonator, the external via extending through the support layer and the piezoelectric layer.