US 12,081,135 B2
Semiconductor module
Takuya Shiraishi, Fukuoka (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Dec. 22, 2021, as Appl. No. 17/559,117.
Claims priority of application No. 2021-057421 (JP), filed on Mar. 30, 2021.
Prior Publication US 2022/0321022 A1, Oct. 6, 2022
Int. Cl. H01L 27/24 (2006.01); H01L 27/07 (2006.01); H02M 7/00 (2006.01); H02M 7/5387 (2007.01); H10B 63/00 (2023.01)
CPC H02M 7/003 (2013.01) [H01L 27/0772 (2013.01); H02M 7/53871 (2013.01); H10B 63/32 (2023.02)] 8 Claims
OG exemplary drawing
 
1. A semiconductor module, comprising:
a first switching device and a second switching device that are connected in series between a main power terminal and a power ground terminal, the first switching device and the second switching device complementarily operating;
a first control device controlling driving the first switching device; and
a second control device controlling driving the second switching device,
wherein the first and second switching devices and the first and second control devices are sealed in a package that is rectangular in a plan view in the semiconductor module,
the package has first and second long sides, and a plurality of signal terminals on a side surface of the first long side input signals to the first and second control devices,
each of the first and second switching devices outputs one of the signals from an output terminal on a side surface of the second long side,
each of the first and second control devices includes a control ground connected to a control ground terminal on the side surface of the first long side,
the main power terminal and the power ground terminal are disposed on the side surface of the second long side, and
the power ground terminal is connected to a current detection resistor disposed outside the package, and is electrically connected inside the package to the control ground terminal through the current detection resistor and an impedance component disposed inside the package.