US 12,080,996 B2
Laser processing machine, processing method, and laser light source
Go Hirano, Tokyo (JP); and Masanao Kamata, Tokyo (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Appl. No. 17/428,712
Filed by SONY GROUP CORPORATION, Tokyo (JP)
PCT Filed Feb. 4, 2020, PCT No. PCT/JP2020/004019
§ 371(c)(1), (2) Date Aug. 5, 2021,
PCT Pub. No. WO2020/166420, PCT Pub. Date Aug. 20, 2020.
Claims priority of application No. 2019-023588 (JP), filed on Feb. 13, 2019.
Prior Publication US 2022/0006263 A1, Jan. 6, 2022
Int. Cl. H01S 5/183 (2006.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); G02B 19/00 (2006.01); G02F 1/35 (2006.01); H01L 21/268 (2006.01); H01S 3/0941 (2006.01); H01S 3/1118 (2023.01); H01S 3/16 (2006.01); H01S 5/42 (2006.01)
CPC H01S 5/18305 (2013.01) [B23K 26/0622 (2015.10); B23K 26/0661 (2013.01); G02B 19/0047 (2013.01); G02F 1/353 (2013.01); H01L 21/268 (2013.01); H01S 3/0941 (2013.01); H01S 3/1118 (2013.01); H01S 3/1618 (2013.01); H01S 3/1643 (2013.01); H01S 5/423 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A laser processing machine, comprising: a laser light source, including: a light emitting body including a substrate and a plurality of bottom emission type vertical-cavity surface-emitting laser elements that are provided on a first surface of the substrate and that each emit an excitation light beam that is output from a second surface side of the substrate; and
a cavity that is disposed in contact with the light emitting body on the other second surface side of the substrate and oscillates a-pulsed laser beams by incidence of the excitation light beams,
wherein the cavity includes a gain medium layer that is excited by the excitation light beams and oscillates laser beams, a supersaturated absorber, and a pair of mirrors sandwiching the gain medium layer and the supersaturated absorber; and
an optical system that causes the pulsed laser beams to contract and applies the pulsed laser beams to a workpiece.