US 12,080,936 B2
Cavity resonance suppression using thermal pedestal arrangements in active electronically scanned array
Michael Buckley, Boyds, MD (US); Tom Walter, Germantown, MD (US); Lal Mohan Bhowmik, Montogomery Village, MD (US); and Varada Rajan Komanduri, Germantown, MD (US)
Assigned to Hughes Network Systems, LLC, Germantown, MD (US)
Filed by Hughes Network Systems, LLC, Germantown, MD (US)
Filed on Mar. 30, 2022, as Appl. No. 17/657,342.
Claims priority of provisional application 63/266,262, filed on Dec. 30, 2021.
Claims priority of provisional application 63/169,770, filed on Apr. 1, 2021.
Prior Publication US 2022/0320705 A1, Oct. 6, 2022
Int. Cl. H01Q 1/02 (2006.01); H01Q 1/24 (2006.01); H01Q 1/42 (2006.01); H01Q 3/36 (2006.01); H04B 15/00 (2006.01); H05K 1/02 (2006.01)
CPC H01Q 1/02 (2013.01) [H01Q 1/24 (2013.01); H01Q 1/42 (2013.01); H01Q 3/36 (2013.01); H04B 15/00 (2013.01); H05K 1/0203 (2013.01); H05K 2201/10098 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An AESA (Active Electronically Scanned Array) comprising:
a PCB (Printed Circuit Board) substrate having an obverse surface;
TRMs (Transmit/Receive Modules) disposed on the obverse surface;
thermal pedestals wherein each thermal pedestal comprises a wall, having a wall height, comprising wall surfaces and one of the wall surfaces being a contact surface; and
a TIM (Thermal Interface Material), having a TIM height, disposed between a respective contact surface of the thermal pedestals and the obverse surface,
wherein a plurality of the thermal pedestals is physically interconnected,
the TIM is electrically and thermally conductive, and
the wall height plus the TIM height are sufficient to suppress resonances of the TRMs below a frequency greater than a Tx/Rx frequency band of the TRMs.