US 12,080,828 B2
Vertical light-emitting diode
Joon Hee Lee, Gyeonggi-do (KR)
Assigned to Seoul Viosys Co., Ltd., Gyeonggi-do (KR)
Filed by SEOUL VIOSYS CO., LTD., Gyeonggi-do (KR)
Filed on Nov. 30, 2021, as Appl. No. 17/538,021.
Application 17/538,021 is a continuation of application No. PCT/KR2019/017222, filed on Dec. 6, 2019.
Claims priority of application No. 10-2019-0064076 (KR), filed on May 30, 2019.
Prior Publication US 2022/0149241 A1, May 12, 2022
Int. Cl. H01L 33/38 (2010.01); H01L 27/15 (2006.01); H01L 33/10 (2010.01); H01L 33/22 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/382 (2013.01) [H01L 27/156 (2013.01); H01L 33/10 (2013.01); H01L 33/22 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01); H01L 33/62 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light emitting diode comprising: a support substrate; a first conductivity type semiconductor layer disposed on the support substrate; an upper insulation layer disposed on the first conductivity type semiconductor layer and comprising a plurality of material layers; a mesa comprising an active layer and a second conductivity type semiconductor layer and disposed under a partial region of the first conductivity type semiconductor layer to expose an edge of the first conductivity type semiconductor layer, the mesa having a plurality of first through-holes and a plurality of second through-holes exposing the first conductivity type semiconductor layer through the second conductivity type semiconductor layer and the active layer; a first electrode disposed between the second conductivity type semiconductor layer and the support substrate, the first electrode comprising: first contact portions electrically connected to the first conductivity type semiconductor layer through the plurality of first through-holes; and second contact portions electrically connected to the first conductivity type semiconductor layer through the plurality of second through-holes; a second electrode disposed between the first electrode and the second conductivity type semiconductor layer and electrically connected to the second conductivity type semiconductor layer; and at least one upper electrode pad disposed adjacent to the first conductivity type semiconductor layer and connected to the second electrode; a first insulation layer disposed between the mesa and the support substrate; a second insulation layer interposed between the first electrode and the second electrode; and a reflection layer disposed between the second insulation layer and the first electrode; wherein one or more of the plurality of first through-holes are surrounded by the active layer and the second conductivity type semiconductor layer and are disposed within a region surrounded by edges of the mesa; and one or more of the plurality of second through-holes are partially surrounded by the active layer and the second conductivity type semiconductor layer and are disposed along the edges of the mesa.