transferring semiconductor light emitting diodes (LEDs) disposed on a growth substrate to a temporary board by bonding the growth substrate and the temporary board, wherein the semiconductor LEDs are disposed at predetermined intervals on the growth substrate and a sacrificial layer to be etched in a fluid is disposed on the temporary board;

placing an acceptor board in the fluid, wherein cells on which the semiconductor LEDs are to be seated are disposed at predetermined intervals on the acceptor board;

aligning the temporary board in the fluid such that the sacrificial layer faces the acceptor board;

forming an electric field for moving the semiconductor LEDs by applying power to at least one of the temporary board or the acceptor board; and

placing the semiconductor LEDs separated from the temporary board in the cells disposed in the acceptor board, wherein the semiconductor LEDs are seated on the acceptor board while maintaining same intervals as the predetermined intervals disposed on the growth substrate.