US 12,080,767 B2
Semiconductor device including passivation patterns
Sung Soo Kim, Hwaseong-si (KR); Joohan Kim, Seoul (KR); Gyuhwan Ahn, Gunpo-si (KR); Ik Soo Kim, Yongin-si (KR); and Jongmin Baek, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 19, 2021, as Appl. No. 17/406,310.
Claims priority of application No. 10-2020-0182042 (KR), filed on Dec. 23, 2020.
Prior Publication US 2022/0199789 A1, Jun. 23, 2022
Int. Cl. H01L 29/41 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01)
CPC H01L 29/41775 (2013.01) [H01L 29/42392 (2013.01); H01L 29/78696 (2013.01); H01L 29/7851 (2013.01); H01L 29/7853 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first active pattern disposed on a substrate;
a device isolation layer that fills a trench which defines the first active pattern;
a first channel pattern and a first source/drain pattern disposed on the first active pattern, the first channel pattern including a plurality of semiconductor patterns that are stacked and spaced apart from each other;
a gate electrode that extends and runs across the first channel pattern;
a gate dielectric layer disposed between the first channel pattern and the gate electrode; and
a first passivation pattern disposed between the device isolation layer and a first sidewall of the first active pattern,
wherein the first passivation pattern includes:
an upper part that protrudes upwardly from the device isolation layer; and
a lower part that is buried in the device isolation layer,
wherein the gate dielectric layer covers the upper part of the first passivation pattern.