| CPC H01L 27/14636 (2013.01) [H01L 23/642 (2013.01); H01L 27/14634 (2013.01); H01L 21/8221 (2013.01); H01L 25/0657 (2013.01); H01L 27/0688 (2013.01)] | 23 Claims |
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1. A light detecting device, comprising:
a first substrate that includes a first semiconductor substrate and a first multi-layered wiring layer on the first semiconductor substrate, wherein the first semiconductor substrate has pixels;
a second substrate that includes a second semiconductor substrate, a second multi-layered wiring layer on a first side of the second semiconductor substrate, and an insulating layer on a second side of the second semiconductor substrate, wherein the second side of the second semiconductor substrate is opposite to the first side of the second semiconductor substrate;
a third substrate that includes a third semiconductor substrate and a third multi-layered wiring layer on the third semiconductor substrate, wherein
each of the second semiconductor substrate and the third semiconductor substrate includes a circuit,
the second substrate is between the first substrate and the third substrate,
the first multi-layered wiring layer is opposite to the second multi-layered wiring layer,
the insulating layer is opposite to the third multi-layered wiring layer,
the first substrate is electrically connected to the second substrate, and wherein
the insulating layer includes a first electrode,
the third multi-layered wiring layer includes a second electrode,
the second substrate includes a first bonding surface,
the third substrate includes a second bonding surface,
the first electrode is joined to the second electrode at the first bonding surface of the second substrate and the second bonding surface of the third substrate;
a first via that penetrates the second semiconductor substrate, wherein the first via electrically connects the first electrode to a first wiring in the second multi-layered wiring layer; and
a second via that electrically connects the second electrode to a second wiring in the third multi-layered wiring layer.
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