US 12,080,726 B2
Glossy display panel, manufacturing method thereof and display device
Xueyan Tian, Beijing (CN); Jianchao Zhu, Beijing (CN); Libin Liu, Beijing (CN); Liangjian Li, Beijing (CN); Caiyu Qu, Beijing (CN); Dengyun Chen, Beijing (CN); and Ximeng Li, Beijing (CN)
Assigned to BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/265,742
Filed by BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Apr. 30, 2020, PCT No. PCT/CN2020/088361
§ 371(c)(1), (2) Date Feb. 3, 2021,
PCT Pub. No. WO2021/217600, PCT Pub. Date Nov. 4, 2021.
Prior Publication US 2022/0115417 A1, Apr. 14, 2022
Int. Cl. H01L 27/12 (2006.01); H01L 27/02 (2006.01); H10K 59/131 (2023.01)
CPC H01L 27/1259 (2013.01) [H01L 27/0292 (2013.01); H01L 27/124 (2013.01); H10K 59/131 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A glossy display panel, comprising: a display area and a non-display area; wherein the non-display area comprises a binding area, and the glossy display panel comprises:
a first conductive pattern that is located on a base substrate and located within the binding area;
a first insulating layer covering the first conductive pattern, wherein the first insulating layer is provided with a first via hole, and an orthographic projection of the first via hole onto the base substrate is located within an orthographic projection of the first conductive pattern onto the base substrate;
a glossy reflection layer located on a side of the first insulating layer distal to the base substrate, wherein an orthographic projection of the glossy reflection layer onto the base substrate does not overlap with an orthographic projection of the binding area onto the base substrate; and
a chip on film (COF) electrically connected to the first conductive pattern through the first via hole.